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2020- 2021

-ELEC 465 & 544


Course Description and Content


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ELEC465 & 544 course outline

ELEC465 - Microsystems Design

EECE544 - Advanced Microsystems design


Course objectives

On the successful completion of this course, the students will be able to:
 - think in a unified way about interdisciplinary microsystems
 - understand the operation of a wide range of sensors and actuators appropriate for microscale systems encompassing different energy domains
 - represent microsystems as generalized networks (in terms of across-through variables), suitable for  design, analysis and simulation
 - master techniques for combining a structured top-down system design approach with bottom-up constraints propagation
 - design and simulate microsystems using behavioral modeling languages and finite element analysis

Course scheduling (tentative)

Wk. 1

Introduction: Microelectronic circuits vs. MEMS vs. Microsystems.

From physical principles to structures and devices: microtransducer operation. Signal domains, Transduction effects, Microsystem factors of merit, Transducer operation techniques, Powering Microsystems. Scaling issues for MEMS. Markets for Microsystems and MEMS.

Wk. 2

From microdevices to Microsystems. Information processing systems

 System level simulation of MEMS: information flow versus energy coupling (across-through variables, bond graph) representations. Structured MEMS design methodology.

Wk. 3

MEMS/NEMS design and analysis levels: macromodeling, finite element analysis, layout (design rules, technological imperfections). Introduction in MEMS design tools and design flows: Comsol Multiphysics, MEMS Pro

Wk. 4

Architectures for Microsystems: open-loop versus closed-loop. From Spice modeling to Analog Hardware Description Languages (VHDL-AMS, Modelica).  Case study: MEMS-based gyroscope.

Wk. 5

Lumped modeling in multiple energy domains. Energy-conserving transducers and dissipative processes. Generic elements: gyrators, transformers, nullors.

Wk. 6

Domain specific details - Mechanical transducers

Elasticity, beam bending, elastic suspensions, energy methods (variational methods, Rayleigh-Ritz methods). Electromechanical coupling: n-port capacitors. Damping in MEMS and mechano-thermal noise.

Wk. 6

Midterm exam. Circuit and system issues. Interface circuitry and architectures. Noise analysis techniques.

Wk. 7

Coupling between behavioral level description and finite element analysis. Reduced order macromodeling techniques. Case study: MEMS accelerometer

Wk. 8

Small signal versus large signal analysis. Nonlinear coupling and instabilities in MEMS devices.

Wk. 9

Piezoelectricity and surface acoustic wave devices. Case studies

Wk. 10

Chemical and biological transducers. From gas sensors to “lab-on-a-chip.”

Wk. 11

Packaging and reliability. Measurement techniques for MEMS

Wk. 12

Conclusions. Toward nano-scale effects and nanosystems. Projects presentations.

Last updated 6-Sep-2020

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